• DocumentCode
    528836
  • Title

    Dynamic thermal management for networked embedded systems under harsh ambient temperature variation

  • Author

    Park, Sangyoung ; Chen, Jian-Jia ; Shin, Donghwa ; Kim, Younghyun ; Yang, Chia-Lin ; Chang, Naehyuck

  • Author_Institution
    Seoul National University, Korea
  • fYear
    2010
  • fDate
    18-20 Aug. 2010
  • Firstpage
    289
  • Lastpage
    294
  • Abstract
    Modern vehicle electronics control units (ECUs) are getting rapidly complicated because of active safety and semi-autonomous driving controls, such as electric stability program (ESP) and adaptive cruise control (ACC). Furthermore, the operational environment of ECUs is extremely harsh, especially in terms of an ambient temperature well exceeding 100°C, which causes a very small temperature headroom. Thus, ECUs require a careful temperature management and high performance at the same time. This paper introduces a dynamic thermal management (DTM) mechanism for networked embedded systems for vehicle ECUs. We exploit a fact that the ambient temperature of each ECU is different and also variable by the temperature of the associated unit while previous DTM considers a fixed ambient temperature as a given constant. We propose a new DTM that controls the rates of tasks with computation migration through the vehicle-area-network to maximize the minimum rate of tasks, which in turn enhances the quality of control and increases the maximum safe vehicle speed. We found that the ambient temperature of each ECU has different behavior for a particular operating condition, and suggest to use a proactive computation migration. We demonstrate dramatic improvement in die temperature control accuracy and average of 12.25% improvements in overall quality of control over distributed reactive DTM for our example cases.
  • Keywords
    Automotive engineering; Engines; Mathematical model; Temperature measurement; Temperature sensors; Time frequency analysis; Vehicles;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Low-Power Electronics and Design (ISLPED), 2010 ACM/IEEE International Symposium on
  • Conference_Location
    Austin, TX, USA
  • Print_ISBN
    978-1-4244-8588-8
  • Type

    conf

  • Filename
    5599059