Title :
Metal interference analysis and design rules of on-chip antennas for wireless interconnect
Author :
He, Xiaowei ; Zhang, Minxuan ; Li, Jinwen ; Li, Shaoqing
Author_Institution :
Nat. Lab. for Parallel & Distrib. Process., Nat. Univ. of Defense Technol., Changsha, China
Abstract :
The influence of on-chip metal interconnections, power grids, heat sink together with packaging, and metal dummy fills on the transmission characteristics of a 2mm-long integrated dipole antenna pair has been investigated in this paper. These metal structures and placements have been classified and particular simulations are performed to explore the interference effects of neighboring various metal structures on transmission gain, phase, impedance and radiation pattern for on-chip dipole antenna pair. By virtue of the experimental results and analyses, several experiential linear expressions for antenna pair gain and phase in interference circumstances are obtained using numerical fit. A set of design rules is concluded accordingly for guiding on-chip antenna layout and design targeting wireless interconnect.
Keywords :
antenna radiation patterns; dipole antennas; electromagnetic interference; integrated circuit interconnections; metals; design rules; heat sink; integrated dipole antenna pair; interference effects; metal dummy fills; metal interference analysis; on-chip antennas; on-chip metal interconnections; packaging; power grids; radiation pattern; size 2 mm; transmission gain; transmission phase; wireless interconnect; Dipole antennas; Metals; Silicon; System-on-a-chip; Transmitting antennas;
Conference_Titel :
Signals Systems and Electronics (ISSSE), 2010 International Symposium on
Conference_Location :
Nanjing
Print_ISBN :
978-1-4244-6352-7
DOI :
10.1109/ISSSE.2010.5607064
