Metal interference analysis and design rules of on-chip antennas for wireless interconnect

Author

He, Xiaowei ; Zhang, Minxuan ; Li, Jinwen ; Li, Shaoqing

Author_Institution

Nat. Lab. for Parallel & Distrib. Process., Nat. Univ. of Defense Technol., Changsha, China

Volume

1

fYear

2010

fDate

17-20 Sept. 2010

Firstpage

1

Lastpage

4

Abstract

The influence of on-chip metal interconnections, power grids, heat sink together with packaging, and metal dummy fills on the transmission characteristics of a 2mm-long integrated dipole antenna pair has been investigated in this paper. These metal structures and placements have been classified and particular simulations are performed to explore the interference effects of neighboring various metal structures on transmission gain, phase, impedance and radiation pattern for on-chip dipole antenna pair. By virtue of the experimental results and analyses, several experiential linear expressions for antenna pair gain and phase in interference circumstances are obtained using numerical fit. A set of design rules is concluded accordingly for guiding on-chip antenna layout and design targeting wireless interconnect.

Keywords

antenna radiation patterns; dipole antennas; electromagnetic interference; integrated circuit interconnections; metals; design rules; heat sink; integrated dipole antenna pair; interference effects; metal dummy fills; metal interference analysis; on-chip antennas; on-chip metal interconnections; packaging; power grids; radiation pattern; size 2 mm; transmission gain; transmission phase; wireless interconnect; Dipole antennas; Metals; Silicon; System-on-a-chip; Transmitting antennas;

fLanguage

English

Publisher

ieee

Conference_Titel

Signals Systems and Electronics (ISSSE), 2010 International Symposium on

Conference_Location

Nanjing

Print_ISBN

978-1-4244-6352-7

Type

conf

DOI

10.1109/ISSSE.2010.5607064

Filename

5607064