• DocumentCode
    530493
  • Title

    The steady-state and transient temperature field of a magnetorheological fluid transmission device

  • Author

    Fu, Hou You ; Zhi, Tian Zu ; Nan, Wang Nan

  • Author_Institution
    Coll. of Mech. & Electr. Eng., China Univ. of Min. & Technol., Xuzhou, China
  • Volume
    2
  • fYear
    2010
  • fDate
    24-26 Aug. 2010
  • Firstpage
    149
  • Lastpage
    153
  • Abstract
    To obtain the influence of temperature field on characteristic of a magnetorheological transmission device, the thermal analysis model is established and the steady-state and transient temperature field of the transmission device is analyzed by finite element method, the influence rules of corresponding factors on temperature field are discussed. The results indicate that temperature of the magnetorheological transmission device decreases from the inside to the outside and the maximum value appears in the center of the disk; the slip power and convection heat transfer coefficients have a great influence on temperature field of working gap between two disks, however, the flow state of air in non-working gap has little influence on temperature; the greater the slip power of the device, the larger the temperature rise rate between two disks; the slip power is 150W when the device runs continuously in steady state, we can improve the allowable slip power by increasing the convection heat transfer coefficients, decreasing working time or adopting the working mode “run- stop- run”.
  • Keywords
    convection; finite element analysis; magnetorheology; thermal analysis; convection heat transfer coefficients; finite element method; magnetorheological fluid transmission device; slip power; thermal analysis model; Erbium; Heating; Magnetic analysis; Shafts; magnetorheological fluid; steady-state; temperature field; transient;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Computer, Mechatronics, Control and Electronic Engineering (CMCE), 2010 International Conference on
  • Conference_Location
    Changchun
  • Print_ISBN
    978-1-4244-7957-3
  • Type

    conf

  • DOI
    10.1109/CMCE.2010.5609689
  • Filename
    5609689