DocumentCode
530496
Title
Notice of Retraction
Analysis of statistical temperature rise for rough surface friction in extrusion forming process
Author
Xianping Sun ; Yao Huang ; Lijun Wei ; Leigang Wang
Author_Institution
Sch. of Mechatron. Eng., Changchun Univerisity of Technol., Changchun, China
Volume
2
fYear
2010
fDate
24-26 Aug. 2010
Firstpage
160
Lastpage
163
Abstract
Notice of Retraction
After careful and considered review of the content of this paper by a duly constituted expert committee, this paper has been found to be in violation of IEEE´s Publication Principles.
We hereby retract the content of this paper. Reasonable effort should be made to remove all past references to this paper.
The presenting author of this paper has the option to appeal this decision by contacting TPII@ieee.org.
The friction between rough surfaces of the tool and workpiece causes temperature rise during relative movement, which aggravates die wear. Based on the elastic contact Hertz theory and the fundamental theory of heat conduction, the temperature distribution on asperity was calculated in the paper. Under the hypothesis that asperity height distribution of rough surfaces accorded with Gauss´s law, the statistical values of embedded depth between contact surfaces were introduced and the statistical temperature rise distribution on asperity was analyzed. The results illustrated that the surface geometry morphology influenced the temperature rise apparently. The distributions of temperature rise in the axial and normal directions were non-uniform and the temperature rise decreased gradually from the centre of asperity. At the initial stage of friction, the temperature rise increased sharply and afterwards became stable gradually. The analysis of temperature rise distribution on the contact area of asperity provided the foundation for establishment of temperature rise model during extrusion forming process.
After careful and considered review of the content of this paper by a duly constituted expert committee, this paper has been found to be in violation of IEEE´s Publication Principles.
We hereby retract the content of this paper. Reasonable effort should be made to remove all past references to this paper.
The presenting author of this paper has the option to appeal this decision by contacting TPII@ieee.org.
The friction between rough surfaces of the tool and workpiece causes temperature rise during relative movement, which aggravates die wear. Based on the elastic contact Hertz theory and the fundamental theory of heat conduction, the temperature distribution on asperity was calculated in the paper. Under the hypothesis that asperity height distribution of rough surfaces accorded with Gauss´s law, the statistical values of embedded depth between contact surfaces were introduced and the statistical temperature rise distribution on asperity was analyzed. The results illustrated that the surface geometry morphology influenced the temperature rise apparently. The distributions of temperature rise in the axial and normal directions were non-uniform and the temperature rise decreased gradually from the centre of asperity. At the initial stage of friction, the temperature rise increased sharply and afterwards became stable gradually. The analysis of temperature rise distribution on the contact area of asperity provided the foundation for establishment of temperature rise model during extrusion forming process.
Keywords
dies (machine tools); elasticity; extrusion; forming processes; friction; heat conduction; mechanical contact; rough surfaces; statistical analysis; surface morphology; temperature distribution; wear; Gauss law; asperity height distribution; die wear; elastic contact Hertz theory; extrusion forming process; heat conduction; rough surface friction; statistical temperature rise; surface geometry morphology; temperature distribution; Lead; Extrusion; Frictional temperature rise; Rough contact surface; Statistic;
fLanguage
English
Publisher
ieee
Conference_Titel
Computer, Mechatronics, Control and Electronic Engineering (CMCE), 2010 International Conference on
Conference_Location
Changchun
Print_ISBN
978-1-4244-7957-3
Type
conf
DOI
10.1109/CMCE.2010.5609694
Filename
5609694
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