Title :
Precision machining of silicon wafers using multi-cutters
Author_Institution :
Sch. of Mechatron., Changchun Inst. of Technol., Changchun, China
Abstract :
The majority of integrated circuits are constructed on silicon wafers nowadays. Precision machining process has great potential to improve wafer quality at a low cost, this paper addressed a new method of machining silicon wafers and its general mathematical model to predict the locus of the machining lines and the distance between two adjacent machining lines using multi-cutters simultaneously. Mathematical expression of machining model was derived, experimental results on experimental device prove feasibility of this new machining method with multi-cutters.
Keywords :
integrated circuit manufacture; machining; mathematical analysis; monolithic integrated circuits; silicon; integrated circuit; mathematical model; multicutters; precision machining process; silicon wafer machining; wafer quality improvement; Educational institutions; Materials; experiment; mathematical model; multi-cutters; precision machining; silicon wafer;
Conference_Titel :
Computer, Mechatronics, Control and Electronic Engineering (CMCE), 2010 International Conference on
Conference_Location :
Changchun
Print_ISBN :
978-1-4244-7957-3
DOI :
10.1109/CMCE.2010.5609902
