DocumentCode
530617
Title
The experimental research of the non-brasive cryogenic polishing monocrystalline silicon wafer super-smooth surface
Author
Shouping, Qu ; Zhongshu, Zhang ; Tianzhu, Liang
Author_Institution
Inst. of Mech. Eng., Changchun Univ., Changchun, China
Volume
2
fYear
2010
fDate
24-26 Aug. 2010
Firstpage
445
Lastpage
448
Abstract
Following the development of IC technology, the IC is developed as high density, high integration, and high-performance. It requires that the semiconductor materials should have super-smooth surfaces in the process of machining chips. In this paper, the new technology of ice disc polishing to polish monocrystalline silicon without abrasive on the cryogenic condition is first put forward. The results of the experiment were recorded in detail. In this experiment, some factors on the impact of surface quality are analyzed.
Keywords
cryogenics; elemental semiconductors; polishing; silicon; IC technology; ice disc polishing; monocrystalline silicon wafer supersmooth surface; nonbrasive cryogenic polishing; surface quality; Electron tubes; ISO; Machining; Pistons; Vibrations; Water pollution; cryogenic polishing; monocrystalline silicon; super-smooth surfaces;
fLanguage
English
Publisher
ieee
Conference_Titel
Computer, Mechatronics, Control and Electronic Engineering (CMCE), 2010 International Conference on
Conference_Location
Changchun
Print_ISBN
978-1-4244-7957-3
Type
conf
DOI
10.1109/CMCE.2010.5610095
Filename
5610095
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