• DocumentCode
    530877
  • Title

    Notice of Retraction
    High speed lapping technology and machine

  • Author

    Yang Jiandong ; Long Duo

  • Author_Institution
    Jilin Bus. & Technol. Coll., Changchun, China
  • Volume
    1
  • fYear
    2010
  • fDate
    24-26 Aug. 2010
  • Firstpage
    101
  • Lastpage
    103
  • Abstract
    Notice of Retraction

    After careful and considered review of the content of this paper by a duly constituted expert committee, this paper has been found to be in violation of IEEE´s Publication Principles.

    We hereby retract the content of this paper. Reasonable effort should be made to remove all past references to this paper.

    The presenting author of this paper has the option to appeal this decision by contacting TPII@ieee.org.

    According to high speed lapping technology with solid abrasives this paper develops a new high speed lapping machine. The high speed lapping technology and the machine are combined into one system through this lapping machine. By means of this way the high speed lapping technology is used in production widely and a very good result has been got. Comparing traditional lapping, by new machine the machining efficiency is increased 30 to 100 times, the abrasives cost is decreased 90%, the machined surface roughness reaches Ra2.55 nm and the machined surface flatness reaches 0.2 μm(P-V), which realizes high efficiency and low cost nanometer lapping. These technology and machines are use by over 30 companies at home and abroad. Remarkable economic results and social effects have been achieved through the users.
  • Keywords
    lapping (machining); machine tools; surface treatment; high speed lapping technology; lapping machine; machining; nanometer lapping; surface roughness; Lapping; Pistons; high speed lapping; lapping machine; machining technology; solid abrasives;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Computer, Mechatronics, Control and Electronic Engineering (CMCE), 2010 International Conference on
  • Conference_Location
    Changchun
  • Print_ISBN
    978-1-4244-7957-3
  • Type

    conf

  • DOI
    10.1109/CMCE.2010.5610538
  • Filename
    5610538