• DocumentCode
    530950
  • Title

    Physical analysis of substrate noise coupling in mixed circuits in SoC technology

  • Author

    Mohamed, Charif ; Barelaud, Bruno ; Ngoya, Edouard

  • Author_Institution
    XLIM, Res. Inst., Limoges, France
  • fYear
    2010
  • fDate
    27-28 Sept. 2010
  • Firstpage
    274
  • Lastpage
    277
  • Abstract
    The paper presents physics based approach for modelling of substrate noise coupling in mixed integrating circuit ICs. It shows that substrate noise corresponds a spontaneous movements of free carriers generated in the Nwell and Pwell region of digitals circuits. The transit time of these carriers from Nwell and Pwell region to silicon substrate introduces a high cutoff frequency controlled by the layers geometric dimensions and the doping profile. This frequency depends on the switching characteristics of digitals circuits. We have shown that the power level at this frequency is higher than the power at the clock and its harmonics, hence it´s the major contributor to substrate noise. The analysis and the results were performed on the DEVEDIT3D, ATLAS and MIXEDMODE tools from SIL VACO.
  • Keywords
    coupled circuits; geometry; integrated circuit noise; mixed analogue-digital integrated circuits; system-on-chip; Nwell region; Pwell region; SoC technology; digital circuit; doping profile; free carrier; geometric dimension; mixed integrating circuit; physical analysis; physics based approach; power level; substrate noise coupling; switching characteristics; CMOS integrated circuits; Inverters; MOS devices; Noise; Semiconductor device modeling; Silicon; Substrates;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microwave Integrated Circuits Conference (EuMIC), 2010 European
  • Conference_Location
    Paris
  • Print_ISBN
    978-1-4244-7231-4
  • Type

    conf

  • Filename
    5613739