60 GHz transceiver architectures deploying substrate integrated circuits (SICs) technique

This paper presents an innovative 60 GHz substrate integrated transceiver system with a broad bandwidth up to 3 GHz. To validate the proposed substrate integrated circuits (SICs) scheme, a 60 GHz wireless communication system with modulated signals is successfully demonstrated for line-of-sight (LOS) channels. The proposed integration technique of planar and non-planar structures allows the design of passive components and active devices within a single package. The passive circuits and high-gain antennas are integrated together with monolithic microwave integrated circuits by simple wire-bonding process. With this design and implementation technique, our 60 GHz transceiver system can demonstrate attractive advantages and features such as low-cost, compact size, low profile and reliable performances.