E-band GaAs antennas packaged with a laminated Multi-Chip Module process

Simulation and test of E-band patch antennas on GaAs considering the full package environment are presented. Single-element and double-element antennas are compared to highlight the influence of the package. The input reflection coefficients of the bare antenna chips were measured on-wafer. The antennas were then packaged using a Laminated Multi-Chip Module (MCM-L) process and the input reflection coefficient measurements repeated. The gain and radiation patterns of the packaged antennas were obtained in an anechoic chamber. A design methodology is presented that leads to good agreement between simulations with a 3D-FD electromagnetic (EM) field solver and measured antenna characteristics. Remaining accuracy limitations are also discussed.