Design, packaging and reliability aspects of RF MEMS circuits fabricated using a GaAs MMIC foundry process technology

Author

Malmqvist, R. ; Samuelsson, C. ; Simon, W. ; Rantakari, P. ; Smith, D. ; Lahdes, Manu ; Lahti, Markku ; Vähä-Heikkilä, T. ; Varis, J. ; Baggen, R.

Author_Institution

FOI Swedish Defence Res. Agency, Linköping, Sweden

fYear

2010

fDate

28-30 Sept. 2010

Firstpage

85

Lastpage

88

Abstract

In this paper, we report on recent results obtained within a pan-European research effort aiming at a successful integration of RF MEMS switches in a GaAs MMIC foundry process technology. Testing and characterization of GaAs based MEMS switches and RF circuits show promising results with respect to switch cycling tests, micro-seconds switching times and the relatively low losses demonstrated up to millimetre-wave frequencies. Compact GaAs RF MEMS based phase shifters together with a possible packaging solution are also presented.

Keywords

III-V semiconductors; MMIC; circuit reliability; micromechanical devices; radiofrequency integrated circuits; GaAs MMIC foundry process technology; RF MEMS circuit design; RF MEMS circuit packaging; RF MEMS circuit reliability; millimetre-wave frequencies; MMICs; phase shifters; radio frequency microelectromechanical systems (RF MEMS); switches;

fLanguage

English

Publisher

ieee

Conference_Titel

Microwave Conference (EuMC), 2010 European

Conference_Location

Paris

Print_ISBN

978-1-4244-7232-1

Type

conf

Filename

5616523