DocumentCode :
531587
Title :
Design, packaging and reliability aspects of RF MEMS circuits fabricated using a GaAs MMIC foundry process technology
Author :
Malmqvist, R. ; Samuelsson, C. ; Simon, W. ; Rantakari, P. ; Smith, D. ; Lahdes, Manu ; Lahti, Markku ; Vähä-Heikkilä, T. ; Varis, J. ; Baggen, R.
Author_Institution :
FOI Swedish Defence Res. Agency, Linköping, Sweden
fYear :
2010
fDate :
28-30 Sept. 2010
Firstpage :
85
Lastpage :
88
Abstract :
In this paper, we report on recent results obtained within a pan-European research effort aiming at a successful integration of RF MEMS switches in a GaAs MMIC foundry process technology. Testing and characterization of GaAs based MEMS switches and RF circuits show promising results with respect to switch cycling tests, micro-seconds switching times and the relatively low losses demonstrated up to millimetre-wave frequencies. Compact GaAs RF MEMS based phase shifters together with a possible packaging solution are also presented.
Keywords :
III-V semiconductors; MMIC; circuit reliability; micromechanical devices; radiofrequency integrated circuits; GaAs MMIC foundry process technology; RF MEMS circuit design; RF MEMS circuit packaging; RF MEMS circuit reliability; millimetre-wave frequencies; MMICs; phase shifters; radio frequency microelectromechanical systems (RF MEMS); switches;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Microwave Conference (EuMC), 2010 European
Conference_Location :
Paris
Print_ISBN :
978-1-4244-7232-1
Type :
conf
Filename :
5616523
Link To Document :
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