• DocumentCode
    531627
  • Title

    An efficient envelope transient simulation of S-Parameters circuits in system simulator

  • Author

    Mehdi, H. ; Bennadji, A. ; Mons, S. ; Ngoya, E. ; Quere, R.

  • Author_Institution
    Univ. of Limoges, Limoges, France
  • fYear
    2010
  • fDate
    28-30 Sept. 2010
  • Firstpage
    1050
  • Lastpage
    1053
  • Abstract
    We present here a novel approach on behavioral modeling of passive RF blocks from frequency domain samples. This approach combines the vectorfitting (VF) algorithm, which is a powerful iterative method for estimating the poles and residues of a MIMO system, associated with the inverse Laplace transform in order to implement passive RF models in a time domain system simulation environment. For our application, the Scilab/Scicos tool is chosen since it allows the resolution of implicit equations, therefore, the implementation of bilateral behavioral models. The impulse responses Sij(t) are then evaluated form previous poles/residues identification process in order to compute the implicit relationship between I and V at each port of the block. This method has been validated in the case of simple circuit (load) and extended to the case of complex MIMO sub-systems such as a full power combiner of a power amplifier (PA). As a result, the envelope transient (TE) S-parameters evaluation of circuits is possible. Thence, the evaluation of complex PAs is submitted to an actual signal (which often includes linear sub-circuits derived from Momentum simulation).
  • Keywords
    Laplace transforms; MIMO communication; S-parameters; iterative methods; power amplifiers; power combiners; MIMO system; S-parameters circuit; Scicos tool; Scilab tool; bilateral behavioral model; envelope transient simulation; inverse Laplace transform; iterative method; passive RF block; power amplifier; power combiner; vector fitting algorithm; Behavioral modeling; MIMO systems; Scilab/Scicos; envelope Transient (TE); vector fitting (VF);
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microwave Conference (EuMC), 2010 European
  • Conference_Location
    Paris
  • Print_ISBN
    978-1-4244-7232-1
  • Type

    conf

  • Filename
    5616591