Dynamic and Electrical Characteristics of Microprobe Testing in Microelectronics Packaging

In order to investigate the performance of microprobe in integrated circuit (IC) testing, a novel testing system with four-wire cable tester and contact force sensor is deployed using high-density microprobes whose resistance and contact force are automatically measured and saved using LabVIEW. The testing resistance is statistically analyzed for DE1-030EB40-010 type probes with adjusted testing parameters. The results show that the displacement effect is significant for resistance testing. In addition, the testing resistance is not a stable and small value until the displacement exceeds 300 μm. Furthermore, the velocity of microprobe varying from 25 to 40 mm/s leads to a minimum deviation. The life cycle testing experiments indicate that some microprobe life cycles are , whereas other life cycles are only 70000 times. It is also found that the contact force is decreased with the increase of life cycles, whereas the decreased contact force results in poor contact between microprobe and IC, which in turn affects the life cycle of the microprobe.