Title :
Notice of Retraction
Investigation on startup characteristics of small-scale flat-plate type capillary pumped loop evaporator
Author :
Wan Junhua ; Wan Zhongmin ; Liu Jing ; Su Kalin ; Li Huan ; Hu Xinghua
Author_Institution :
Sch. of Inf. & Commun. Eng., Hunan Inst. of Sci. & Technol., Yueyang, China
Abstract :
Notice of Retraction
After careful and considered review of the content of this paper by a duly constituted expert committee, this paper has been found to be in violation of IEEE´s Publication Principles.
We hereby retract the content of this paper. Reasonable effort should be made to remove all past references to this paper.
The presenting author of this paper has the option to appeal this decision by contacting TPII@ieee.org.
The features of startup process and the reasons which result in the failure of small-scale flat-plate type capillary pumped loop (CPL) evaporator during the preheating stage are analyzed. The unsteady heat transfer model of evaporator in the fully-flooded startup stage is presented, and the model is solved with SIMPLE algorithm. The numerical results show the preheating stage of evaporator requires less time. The average temperature difference between upper surface and bottom surface of wick has a steady maximum value corresponding to different applied heat loads. For the higher heat flux, the preheating stage requires shorter time, and average temperature difference is bigger, it is useful for successful startup of capillary evaporator.
Keywords :
evaporation; heat exchangers; heat transfer; plates (structures); SIMPLE algorithm; applied heat loads; average temperature difference; bottom surface; failure; fully-flooded startup stage; heat flux; preheating stage; small-scale flat-plate type capillary pumped loop evaporator; startup characteristics; startup process; unsteady heat transfer model; upper surface; wick; Educational institutions; Heating; Lead; capillary pumped loop; evaporator; flat-plate type; preheating stage; startup characteristic;
Conference_Titel :
Computer Application and System Modeling (ICCASM), 2010 International Conference on
Conference_Location :
Taiyuan
Print_ISBN :
978-1-4244-7235-2
DOI :
10.1109/ICCASM.2010.5622514