DocumentCode
533350
Title
Effects of TVS integration on system level ESD robustness
Author
Huang, Wei ; Dunnihoo, Jeffrey ; Pommerenke, David
Author_Institution
Electromagn. Compatibility Lab., Missouri Univ. of Sci. & Technol. (MST), Rolla, MO, USA
fYear
2010
fDate
3-8 Oct. 2010
Firstpage
1
Lastpage
6
Abstract
Higher integration of Transient Voltage Suppression (TVS) functionality into ASIC I/O cells implies lower system costs. But as the ESD pulse is directed deeper into the system, migrating the TVS clamping function from the periphery of the system to a central ASIC may actually reduce the system´s ESD robustness. ESD current reconstruction scanning can be used to trace the current path on a PCB, and possibly within an IC. The article compares the current spreading during and ESD for different ESD protection methods.
Keywords
application specific integrated circuits; electrostatic discharge; printed circuits; transient analysis; ASIC I/O cells; ESD current reconstruction scanning; ESD protection methods; ESD pulse; IC; PCB; TVS clamping function; TVS integration effect; system costs; system level ESD robustness; transient voltage suppression functionality; Application specific integrated circuits; Clamps; Electromagnetic compatibility; Electrostatic discharge; Probes; Robustness; Universal Serial Bus;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Overstress/ Electrostatic Discharge Symposium (EOS/ESD), 2010 32nd
Conference_Location
Reno, NV
Print_ISBN
978-1-58537-182-2
Electronic_ISBN
978-1-58537-182-2
Type
conf
Filename
5623717
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