• DocumentCode
    533350
  • Title

    Effects of TVS integration on system level ESD robustness

  • Author

    Huang, Wei ; Dunnihoo, Jeffrey ; Pommerenke, David

  • Author_Institution
    Electromagn. Compatibility Lab., Missouri Univ. of Sci. & Technol. (MST), Rolla, MO, USA
  • fYear
    2010
  • fDate
    3-8 Oct. 2010
  • Firstpage
    1
  • Lastpage
    6
  • Abstract
    Higher integration of Transient Voltage Suppression (TVS) functionality into ASIC I/O cells implies lower system costs. But as the ESD pulse is directed deeper into the system, migrating the TVS clamping function from the periphery of the system to a central ASIC may actually reduce the system´s ESD robustness. ESD current reconstruction scanning can be used to trace the current path on a PCB, and possibly within an IC. The article compares the current spreading during and ESD for different ESD protection methods.
  • Keywords
    application specific integrated circuits; electrostatic discharge; printed circuits; transient analysis; ASIC I/O cells; ESD current reconstruction scanning; ESD protection methods; ESD pulse; IC; PCB; TVS clamping function; TVS integration effect; system costs; system level ESD robustness; transient voltage suppression functionality; Application specific integrated circuits; Clamps; Electromagnetic compatibility; Electrostatic discharge; Probes; Robustness; Universal Serial Bus;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Overstress/ Electrostatic Discharge Symposium (EOS/ESD), 2010 32nd
  • Conference_Location
    Reno, NV
  • Print_ISBN
    978-1-58537-182-2
  • Electronic_ISBN
    978-1-58537-182-2
  • Type

    conf

  • Filename
    5623717