• DocumentCode
    533596
  • Title

    Research on key Technology of MID

  • Author

    Xu, Wenjin

  • Author_Institution
    Coll. of Inf. Sci. & Technol., Qingdao Univ. of Sci. & Technol., Qingdao, China
  • Volume
    1
  • fYear
    2010
  • fDate
    1-2 Aug. 2010
  • Firstpage
    133
  • Lastpage
    135
  • Abstract
    This paper introduced the three-dimensional molding mechanical and electrical integration unit, Molded Interconnect Devices (MID) of this new type of electronic components, and the key Technology from their composition, functions, processing methods, the MID Briefing, and pointed out its development prospects to the future.
  • Keywords
    compression moulding; MID briefing; MID key technology; electronic components; mechanical-electrical integration unit; molded interconnect devices; three dimensional molding; Algorithm design and analysis; Geometry; Lasers; Metallization; Production; Assembly; MID; Molded Interconnect Devices; Three-dimensional circuit;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Circuits,Communications and System (PACCS), 2010 Second Pacific-Asia Conference on
  • Conference_Location
    Beijing
  • Print_ISBN
    978-1-4244-7969-6
  • Type

    conf

  • DOI
    10.1109/PACCS.2010.5627048
  • Filename
    5627048
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=533596