DocumentCode :
534307
Title :
Two-phase flow boiling of R134a in a multi-microchannel heat sink for microprocessor cooling
Author :
Madhour, Yassir ; Olivier, Jonathan ; Costa-Patry, Etienne ; Paredes, Stephan ; Michel, Bruno ; Thome, John Richard
Author_Institution :
Heat & Mass Transfer Lab., Ecole Polytech. Fed. de Lausanne, Lausanne, Switzerland
fYear :
2010
fDate :
6-8 Oct. 2010
Firstpage :
1
Lastpage :
6
Abstract :
The following study concentrates on two-phase flow boiling of refrigerant R134a inside two similar copper multi-microchannel heat sinks, one of which was designed for singlephase water cooling of microprocessors. The two-phase heat sink was composed of 100 parallel microchannels, 100 μm wide, 680 μm high, 15 mm long with 72 μm-thick fins, and 63 parallel microchannels. Base heat fluxes and channel-based mass fluxes were varied from 2.57 to 190 W/cm2 and from 205 to 1000 kg/m2 s, all at a nominal saturation temperature of 63°C. Local heat transfer coefficients were measured at 35 locations using localized heaters and temperature sensors. The main trend identified was that the heat transfer coefficient increased with heat flux at all vapor qualities and mass fluxes tested. Heat transfer coefficients as high as 250´000 W/m2K (relative to the base area) were reached, keeping the chip under 85°C. Backflow and flow instabilities were the main issues with the single-phase heat sink when used in flow boiling, leading to flow mal-distribution and jet impingement effects.
Keywords :
boiling; cooling; heat sinks; microchannel flow; microprocessor chips; temperature sensors; flow mal-distribution; heat flux; jet impingement; local heat transfer coefficients; localized heaters; mass flux; microprocessor cooling; multimicrochannel heat sink; refrigerant R134a; single phase water cooling; size 100 mum; size 15 mm; size 680 mum; size 72 mum; temperature sensors; thick fins; two-phase flow boiling; Fluids; Heat sinks; Heat transfer; Heating; Microchannel; Temperature measurement;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Thermal Investigations of ICs and Systems (THERMINIC), 2010 16th International Workshop on
Conference_Location :
Barcelona
Print_ISBN :
978-1-4244-8453-9
Type :
conf
Filename :
5636302
Link To Document :
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