Thermal interface materials based on carbon nanotubes and their thermal characterization

Author

Kasimir, M. ; Gharagozloo-Hubmann, K. ; Trotsenko, S. ; Czempiel, G.J.F. ; Datsyuk, V. ; Reich, S.

Author_Institution

Inst. of Exp. Phys., Freie Univ. Berlin, Berlin, Germany

fYear

2010

fDate

6-8 Oct. 2010

Firstpage

1

Lastpage

6

Abstract

We determined the thermal properties of thermal interface materials (TIMs) based on carbon nanotubes (CNTs) and commercial TIMs. The thermal conductivity of different fillers such as CNTs, graphite, nano-diamond, metal, and metal oxide particles (copper and zinc oxide) at different concentrations were studied with a transient plane source technique. For measuring the thermal diffusivity with the Xenon flash method we constructed two novel sample holders and applied them for the measurement of pastes. An open CPU-heat sink setup was used to test interface materials under realistic conditions. Interesting results regarding to the paste composition according to filling content, particle size and viscosity could be obtained.

Keywords

carbon nanotubes; thermal analysis; thermal conductivity; thermal management (packaging); CNTs; CPU-heat sink setup; Xenon flash method; carbon nanotubes; copper; graphite; metal oxide particles; nanodiamond; thermal characterization; thermal conductivity; thermal diffusivity; thermal interface materials; thermal properties; zinc oxide; Conductivity; Containers; Heat sinks; Heating; Materials; Temperature measurement; Thermal conductivity; carbon nanotubes; thermal conductivity; thermal diffusivity; thermal interface material;

fLanguage

English

Publisher

ieee

Conference_Titel

Thermal Investigations of ICs and Systems (THERMINIC), 2010 16th International Workshop on

Conference_Location

Barcelona

Print_ISBN

978-1-4244-8453-9

Type

conf

Filename

5636353