Title :
Mathematical and computing modeling of temperature fields in electronic modules
Author :
Kandalov, Peter I. ; Madera, Alexander G.
Author_Institution :
Sci.-Res. Inst. for Syst. Studies, Russian Acad. of Sci., Moscow, Russia
Abstract :
The article is devoted to mathematical and computing modelling of three-dimensional thermal fields in complicated electronics modules constructions with multilayer PCB and IC. The simulation technique is implemented as a program for PC.
Keywords :
electronic engineering computing; integrated circuit modelling; integrated circuit packaging; mathematical analysis; modules; printed circuits; thermal management (packaging); PC program; computing modeling; electronic modules; mathematical modelling; multilayer IC; multilayer PCB; three-dimensional thermal field simulation;
Conference_Titel :
Thermal Investigations of ICs and Systems (THERMINIC), 2010 16th International Workshop on
Conference_Location :
Barcelona
Print_ISBN :
978-1-4244-8453-9
