• DocumentCode
    534873
  • Title

    FDSOI metal gate transistors for ultra low power subthreshold operation

  • Author

    Vitale, S.A. ; Kedzierski, J. ; Wyatt, P.W. ; Renzi, M. ; Keast, C.L.

  • Author_Institution
    MIT Lincoln Lab., Lexington, MA, USA
  • fYear
    2010
  • fDate
    11-14 Oct. 2010
  • Firstpage
    1
  • Lastpage
    2
  • Abstract
    A workfunction-tuned TiN metal gate is integrated into ultra-low-power FDSOI CMOS transistors, optimized for subthreshold operation at 0.3 V. The workfunction of the TiN metal gate is tunable across the mid-gap range, by adjusting deposition parameters and post-deposition annealing. The transistors show 71% reduction in Cgd and 55% reduction in Vt variation, compared to conventional FDSOI transistors of the same size. A 59% decrease in switching energy and a 91% decrease in stage delay is demonstrated in ring oscillators fabricated with the subthreshold-optimized FDSOI transistors when compared to commercial bulk silicon devices.
  • Keywords
    CMOS integrated circuits; MOSFET; annealing; low-power electronics; oscillators; silicon; silicon-on-insulator; FDSOI metal gate transistors; commercial bulk silicon devices; deposition parameters; post-deposition annealing; ring oscillators; subthreshold-optimized FDSOI transistors; switching energy; ultra low power subthreshold operation; ultra-low-power FDSOI CMOS transistors; workfunction-tuned metal gate; Capacitance; Logic gates; Ring oscillators; Silicon; Tin; Transistors;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    SOI Conference (SOI), 2010 IEEE International
  • Conference_Location
    San Diego, CA
  • ISSN
    1078-621x
  • Print_ISBN
    978-1-4244-9130-8
  • Electronic_ISBN
    1078-621x
  • Type

    conf

  • DOI
    10.1109/SOI.2010.5641399
  • Filename
    5641399