DocumentCode
534873
Title
FDSOI metal gate transistors for ultra low power subthreshold operation
Author
Vitale, S.A. ; Kedzierski, J. ; Wyatt, P.W. ; Renzi, M. ; Keast, C.L.
Author_Institution
MIT Lincoln Lab., Lexington, MA, USA
fYear
2010
fDate
11-14 Oct. 2010
Firstpage
1
Lastpage
2
Abstract
A workfunction-tuned TiN metal gate is integrated into ultra-low-power FDSOI CMOS transistors, optimized for subthreshold operation at 0.3 V. The workfunction of the TiN metal gate is tunable across the mid-gap range, by adjusting deposition parameters and post-deposition annealing. The transistors show 71% reduction in Cgd and 55% reduction in Vt variation, compared to conventional FDSOI transistors of the same size. A 59% decrease in switching energy and a 91% decrease in stage delay is demonstrated in ring oscillators fabricated with the subthreshold-optimized FDSOI transistors when compared to commercial bulk silicon devices.
Keywords
CMOS integrated circuits; MOSFET; annealing; low-power electronics; oscillators; silicon; silicon-on-insulator; FDSOI metal gate transistors; commercial bulk silicon devices; deposition parameters; post-deposition annealing; ring oscillators; subthreshold-optimized FDSOI transistors; switching energy; ultra low power subthreshold operation; ultra-low-power FDSOI CMOS transistors; workfunction-tuned metal gate; Capacitance; Logic gates; Ring oscillators; Silicon; Tin; Transistors;
fLanguage
English
Publisher
ieee
Conference_Titel
SOI Conference (SOI), 2010 IEEE International
Conference_Location
San Diego, CA
ISSN
1078-621x
Print_ISBN
978-1-4244-9130-8
Electronic_ISBN
1078-621x
Type
conf
DOI
10.1109/SOI.2010.5641399
Filename
5641399
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