A fast positioning method with pattern tracking for automatic wafer alignment

The applicable wafer bonding process for semiconductor industry is usually administered in a three-dimensional oxides structure design. The bonding technology of the silicon-silicon wafer is an important process because the mechanical structure and the circuit layout of the wafer surface must be positioned accurately. This study focuses on the automatic alignment algorithms for the wafer bonding system, in which the crisscross marks on the surfaces of the two wafers aligned by pattern recognition and image processing technology and a fast positioning system with feedback control to achieve a fast and accurate wafer bonding process.