Title :
Full-Field Displacement and Strain Measurements for Debonding Test of SMPM Laminates Using ESPI
Author :
Tong, Guo ; Yongsheng, Song
Author_Institution :
Key Lab. of Bridge-Struct. Eng., Chongqing Jiaotong Univ., Chongqing, China
Abstract :
This paper presents the full-field displacement and strain measurements in the debonding tests of steel stranded wire mesh and polymer mortar (SMPM) laminates bonded to concrete, in which the electronic speckle pattern interferometry (ESPI) with four-phase shifting technique is used. The in-plane displacements of SMPM laminates are obtained by measuring the changes in phase patterns due to deformation. Derivation of displacements resulted in strains. The propagation of interference fringes and the characteristic of strain distributions are recorded and analyzed. It is concluded that the ESPI, being a whole-field non-contacting optical method, is suitable for the study of debonding mechanism of composites. However, the rigid body motions of test specimens should be strictly restrained. The strain distribution on the surface of SMPM laminates is different from that of the well-used fiber reinforced polymer (FRP) laminates, and the position of transversal stranded wires has a significant influence on the strain distribution and the debonding load. Results of this study can be used for developing the interfacial bond-slip relationship of SMPM laminates bonded to concrete.
Keywords :
concrete; deformation; electronic speckle pattern interferometry; laminates; mortar; phase shifting interferometry; strain measurement; ESPI; SMPM laminates; composites; concrete; debonding test; deformation; electronic speckle pattern interferometry; fiber reinforced polymer laminates; four-phase shifting technique; full-field displacement; interfacial bond-slip relationship; interference fringes; polymer mortar; rigid body motions; steel stranded wire mesh; strain distributions; strain measurements; test specimens; transversal stranded wires; whole-field noncontacting optical method; Debonding; Electronic speckle pattern interferometry; Non destructive testing; Phase shifting;
Conference_Titel :
Optoelectronics and Image Processing (ICOIP), 2010 International Conference on
Conference_Location :
Haiko
Print_ISBN :
978-1-4244-8683-0
DOI :
10.1109/ICOIP.2010.293