The new intelligent power modules with Reverse conducting IGBTs and SOI driver for low power motor drives

Author

Song, Junho ; Lee, Junbae ; Chung, Daewoong ; Wolfgang, Frank

Author_Institution

LS Power Semitech, Germany

fYear

2010

fDate

10-13 Oct. 2010

Firstpage

384

Lastpage

386

Abstract

This paper presents a new CIPOS™ (Control Integrated Power System) in DIL (Dual-in-line) package, which combines with the features of Infineon trench field stop RC (Reverse conducting) IGBT and a newly optimized Infineon SOI (Silicon On Insulator) gate driver to achieve the excellent solution for upto 2.5kW motor drives. It also comes along with flexible internal schematics, which are tailor made for the target applications by using the combination of PCB and lead-frame. This paper provides an overall description of the new CIPOS™ module as well as performance, power ratings, adopted RC-IGBT and SOI gate driver.

Keywords

electronics packaging; insulated gate bipolar transistors; motor drives; printed circuits; silicon-on-insulator; CIPOS module; Infineon SOI; Infineon trench field; PCB; SOI gate driver; control integrated power system; dual-in-line package; intelligent power modules; lead frame; low power motor drives; reverse conducting IGBT; silicon on insulator; Driver circuits; Insulated gate bipolar transistors; Integrated circuits; Inverters; Logic gates; Silicon on insulator technology; Temperature measurement;

fLanguage

English

Publisher

ieee

Conference_Titel

Electrical Machines and Systems (ICEMS), 2010 International Conference on

Conference_Location

Incheon

Print_ISBN

978-1-4244-7720-3

Type

conf

Filename

5663302