Title :
An SoC evaluation platform for dual link MIMO-OFDMA communications
Author :
Wu, Yu-Jen ; Lin, Jung-Mao ; Yu, Hsin-Yi ; Liu, Szu-Chi ; Ma, Hsi-Pin
Author_Institution :
Dept. of Electr. Eng., Nat. Tsing Hua Univ., Hsinchu, Taiwan
Abstract :
In this paper, an efficient and flexible SoC platform integrated with intellectual property (IP) cores for multiinput multi-output orthogonal frequency division multiple access (MIMO-OFDMA) transceiver of IEEE802.16e-2005 standard is presented. The proposed platform supports uplink/downlink and is integrated with the evaluation system. The hardware and software design have been synthesized and verified. The proposed platform provides a complete system design. It is a flexible prototyping for worldwide interoperability for microwave access (WiMAX) communication system. Designers could use platform-based design approach as an effective strategy to cope with product complexity and time-to-market at all levels. For the verification stage, designers can use the hardware/software (HW/SW) co-verification strategy to debug hardware component, which will help designers identify more faster. In this proposed platform, which introduces the figure file to be the transmission media. Designers validate their design in bit error rate/signal-to-noise ratio (BER/SNR) waveforms traditionally. In this proposed platform, designer could verify the decoded results in various environment by LCD panel.
Keywords :
MIMO communication; frequency division multiple access; hardware-software codesign; industrial property; radio transceivers; system-on-chip; IEEE802.16e-2005 standard; LCD panel; WiMAX; bit error rate; dual link MIMO-OFDMA communications; hardware-software co-verification; intellectual property; orthogonal frequency division multiple access; radio transceivers; signal-to-noise ratio; Field programmable gate arrays; Hardware; MIMO; Receivers; System-on-a-chip; Transceivers; Transmitters;
Conference_Titel :
Communications and Networking in China (CHINACOM), 2010 5th International ICST Conference on
Conference_Location :
Beijing
Print_ISBN :
973-963-9799-97-4