Warpage simulation for encapsulated package during post-mold curing process

Author

Huang, H.-W. ; Chiu, T.-C. ; Lai, Y.-S.

Author_Institution

Dept. of Mech. Eng., Nat. Cheng Kung Univ., Tainan, Taiwan

fYear

2010

fDate

20-22 Oct. 2010

Firstpage

1

Lastpage

4

Abstract

In this study the effects of polymerization conversion and chemical aging on the constitutive behavior and dimension change were characterized and modeled for a commercial epoxy molding compound. Numerical finite element models incorporating these physical and thermomechanical models were developed for simulating the warpage evolution of overmolded BGA packages during post-mold curing (PMC) process. The numerical results were compared to experimental Shadow Moire analyses for validating the modeling methodology. From the analyses it was observed that, while the chemical aging of the molding compound contributed little to the total crosslinking reaction during molding and PMC, it has a significant influence on package warpage during and after the PMC process.

Keywords

ageing; ball grid arrays; curing; encapsulation; finite element analysis; moulding; polymerisation; chemical aging; encapsulated package; epoxy molding compound; finite element models; overmolded BGA packages; physical model; polymerization conversion; post mold curing process; shadow moire analysis; thermomechanical model; warpage simulation; Aging; Chemicals; Compounds; Curing; Isothermal processes; Numerical models; Polymers;

fLanguage

English

Publisher

ieee

Conference_Titel

Microsystems Packaging Assembly and Circuits Technology Conference (IMPACT), 2010 5th International

Conference_Location

Taipei

ISSN

2150-5934

Print_ISBN

978-1-4244-9783-6

Electronic_ISBN

2150-5934

Type

conf

DOI

10.1109/IMPACT.2010.5699576

Filename

5699576