• DocumentCode
    538619
  • Title

    Development of SMA thin film deposited on buffer layer

  • Author

    Tsuchiya, K. ; Sato, T.

  • Author_Institution
    Dept. of Precision Eng., Tokai Univ., Hiratsuka, Japan
  • fYear
    2010
  • fDate
    12-15 Dec. 2010
  • Firstpage
    193
  • Lastpage
    194
  • Abstract
    The shape memory effect for TiNi to improve by using strain in the thin film deposited on a buffer layer (Nb, Mo, Ta, and W) has been investigated. First of all, the contact points on each surface between TiNi thin film and buffer layers (where the contact point is defined as atomic position difference for bonding between each atom on lattice axis in both surface of thin film and buffer layer) were calculated to obtain the mismatch rate under 1 %. Secondly, TiNi thin films on each buffer layers deposited by ECR sputter deposition method were evaluated by XRD and these strains in the films by changed lattice constants by the effect of buffer layer were also calculated from the sifted incident angles based on ICDD. As the result, the relationship between contact points and strained lattice constant in thin film calculated by using data based on XRD intensity data showed strong negative correlations and the contact points is effective to control the lattice constant of the thin films to give the strain into the thin film.
  • Keywords
    X-ray diffraction; buffer layers; internal stresses; lattice constants; metallic thin films; nickel alloys; shape memory effects; sputter deposition; titanium alloys; ECR sputter deposition; Mo; Nb; Ta; TiNi; W; XRD; atomic position difference; buffer layers; lattice axis bonding; shape memory alloy thin film; shape memory effect; strained lattice constants; surface contact points; Argon; Films; Niobium; Substrates;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Optoelectronic and Microelectronic Materials and Devices (COMMAD), 2010 Conference on
  • Conference_Location
    Canberra, ACT
  • ISSN
    1097-2137
  • Print_ISBN
    978-1-4244-7334-2
  • Electronic_ISBN
    1097-2137
  • Type

    conf

  • DOI
    10.1109/COMMAD.2010.5699735
  • Filename
    5699735