Title :
Research of Control and Scheduling for Die-Bonding
Author_Institution :
Fac. of Forensic Sci. & Technol., Guangdong Police Coll., Guangzhou, China
Abstract :
Die-bonding is a necessary machine in semiconductor production line. In the thesis, the control and scheduling for the machine is focused on. Firstly, analyzing atypical task-scheduling algorithm in single-processor real-time system and introducing the work flow. Secondly, giving the software framework based on thread-pool for the control platform. Finally, discussing motion control module and triode-wafer detection module in detail.
Keywords :
control engineering computing; microassembling; motion control; production engineering computing; production equipment; semiconductor industry; single machine scheduling; control platform; die bonding; motion control module; production machine; semiconductor production line; single processor real time system; software framework; task scheduling algorithm; thread pool; triode wafer detection module; Instruction sets; Job shop scheduling; Microassembly; Motion control; Operating systems; Real time systems; Linux Operation System; Motion Control; Multi-task Cooperation; Wafer Detection;
Conference_Titel :
Intelligent Systems (GCIS), 2010 Second WRI Global Congress on
Conference_Location :
Wuhan
Print_ISBN :
978-1-4244-9247-3
DOI :
10.1109/GCIS.2010.152
