Throughput improvement with setup reduction focusing on process identification

We improved throughput by reducing operational loss that occurs owing to the process condition change in semiconductor manufacturing equipments. As a result of Equipment Engineering System (EES) data analysis, we found that it took time from several to ten percent of Raw Processing Time to adjust etchers Electrostatic Chuck (ESC) temperature. Controlling ESC temperature of each recipe based on process flow and process information, and processing the same ESC temperature process consecutively for a certain period have resulted in throughput improvement in etching process by up to 7 percent and by 4 percent on average.