DocumentCode :
539389
Title :
Using DEA for relative efficiency analysis of wafer fabrication facilities
Author :
Lin, Wan-Ling ; Chien, Chen-Fu ; Chen, Wen-Chih ; Wu, Wen-Chin ; Wang, Hsin-Yin ; Kuo, Ren-Tsun ; Chou, Ming-Hsuan
Author_Institution :
Taiwan Semiconductor Manufacturing Company Ltd., No.8, Li-Hsin 6th RD., Science-Based Industrial Park, Hsin Chu, Taiwan, R.O.C.
fYear :
2008
fDate :
27-29 Oct. 2008
Firstpage :
125
Lastpage :
128
Abstract :
Semiconductor industry is capital-incentive, competitive, and having complicated manufacturing processes. It is essential to utilize resources efficiently to provide products and services for maintaining competitive advantages. Knowing whether the resource is properly utilized is the foundation for future improvements and/or production decision. Due to the disparate units involved, direct evaluation and comparison among the fabs is difficult. This study aims to develop a two-stage model for relative comparison on fabrication operations by adopting data envelopment analysis (DEA). The proposed model clearly defines and differentiates the performance of fab production, and provides an overall performance index while considering different aspects.
Keywords :
Data envelopment analysis; Fabrication; Industrial engineering; Productivity; Semiconductor device modeling;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Semiconductor Manufacturing (ISSM), 2008 International Symposium on
Conference_Location :
Tokyo, Japan
ISSN :
1523-553X
Electronic_ISBN :
1523-553X
Type :
conf
Filename :
5714910
Link To Document :
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