DocumentCode
539396
Title
Centering value by using TSMRA prediction of CD process variation
Author
Murashima, Shigenobu ; Mizuhara, Noriaki ; Nishimura, Susumu
Author_Institution
NEC Semiconductors Kansai, Ltd, 9-1, Seiran 2-Chome, Otsu City, Shiga 520-8555, Japan
fYear
2008
fDate
27-29 Oct. 2008
Firstpage
277
Lastpage
280
Abstract
This paper presents the accurate control method of process parameters by TSMRA: time series analysis added multiple regression analysis. This method has been applied to gate CD process of microwave devices and the best yield has been achieved.
Keywords
Correlation; Equations; Etching; Mathematical model; Process control; Time series analysis; Tuning;
fLanguage
English
Publisher
ieee
Conference_Titel
Semiconductor Manufacturing (ISSM), 2008 International Symposium on
Conference_Location
Tokyo, Japan
ISSN
1523-553X
Electronic_ISBN
1523-553X
Type
conf
Filename
5714917
Link To Document