DocumentCode
539432
Title
Direct monitoring of semiconductor wafer cleaning solutions using attenuated total reflection far ultraviolet spectroscopy
Author
Higashi, Noboru ; Kariyama, Naomi ; Ikehata, Akifumi ; Ozaki, Yukihiro
Author_Institution
Kurabo Ind. Ltd, 14-5, Shimokida-cho, Neyagawa City, Osaka, 572-0823, Japan
fYear
2008
fDate
27-29 Oct. 2008
Firstpage
241
Lastpage
244
Abstract
Far-ultraviolet (FUV) spectroscopy combined with attenuated total reflection (ATR) is employed for direct measurement of the concentrations of semiconductor wafer cleaning fluids such as SC-1 and SC-2. FUV absorption spectra of these aqueous solutions in the 170 – 200 nm region are highly sensitive to changes in both hydrogen bonding and hydration. We adopt quartz as an internal reflection element (IRE) for ATR measurement. We created calibration models for predicting both NH3 and H2 O2 in the concentration ranges of 1 – 10 % in SC-1 using multiple linear regression (MLR). The standard deviations of the models were 0.033 % and 0.265 % for NH3 and H2 O2 , respectively. The same procedure was repeated under the same conditions for HCl and H2 O2 in SC-2, yielding corresponding values of 0.018 % for HCl and 0.178 % for H2 O2 .
Keywords
Absorption; Cleaning; Fluids; Probes; Reflection; Semiconductor device measurement; Temperature measurement;
fLanguage
English
Publisher
ieee
Conference_Titel
Semiconductor Manufacturing (ISSM), 2008 International Symposium on
Conference_Location
Tokyo, Japan
ISSN
1523-553X
Electronic_ISBN
1523-553X
Type
conf
Filename
5714954
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