From simulation to characterization - integrated approach for Self Aligned Double Patterning defectivity

SADP (Self Aligned Double Patterning) is one of the major options to be implemented to bridge the lithography resolution gaps for 40 nm half pitch nodes and below. A natural concern for IC manufacturers when developing and/or implementing this kind of module is defectivity control strategy to ensure all defect sources are understood and an appropriate inspection strategy can be implemented to ensure high die yields. In this paper we will share a comprehensive study done to understand & characterize the major defect types in the SADP module developed by the Maydan Technology Center of Applied Materials. The implications of this work in terms of setting an optimized inspection strategy in the module will be discussed.