Title :
Analysis of Deep Scratch
Author :
Takeda, Daisuke ; Takahashi, Teruhiko ; Tsuken, Tadamichi
Author_Institution :
Spansion Japan CO., Ltd., 2-Takaku-Aizuwakamatsu-shi Fukushima 965-0000 Japan
Abstract :
Minute contact short can be generated between the contact plugs after a fragile film such as BPSG is polished, and it causes a serious fault on the function of the device. The yield decreases by as much as 27% (worst case). This defect is called Deep Scratch. The mechanism of the Deep Scratch was examined and we successfully verified the mechanism.
Keywords :
Cleaning; Etching; Films; Semiconductor device modeling; Shape; Silicon compounds; Slurries;
Conference_Titel :
Semiconductor Manufacturing (ISSM), 2008 International Symposium on
Conference_Location :
Tokyo, Japan
Electronic_ISBN :
1523-553X
