• DocumentCode
    540301
  • Title

    Ferromagnetic nanowire (FMNW) self-biased H-plane resonance isolator

  • Author

    Razavipour, Hadi ; Carignan, Louis-Philippe ; Ménard, David ; Yelon, Arthur ; Caloz, Christophe

  • Author_Institution
    Dept. of Electr. Eng., Ecole Polytech. de Montreal, Montréal, QC, Canada
  • fYear
    2010
  • fDate
    7-10 Dec. 2010
  • Firstpage
    1517
  • Lastpage
    1520
  • Abstract
    A novel resonant type H-plane isolator based on a ferromagnetic nanowire (FMNW) slab is presented. As a result of the remanence property of FMNW materials, the device is self-biased and therefore does not require any magnet. Moreover, the structure does not suffer from the conventional H-plane isolator drawback of demagnetization, which renders this configuration, characterized by superior heat dissipation capability, a competitive alternative to the E-plane resonance isolator. The inherent remanence of the FMNW material makes the shorter double and quadruple slab configurations more practical than their conventional ferrite counterparts. The proposed device is very compact, lightweight, and low-cost. Simulations based on two different methods, the finite integration technique (FIT) and the finite element method (FEM), predict an isolation of over 20 dB and insertion loss of less than 1 dB for a relatively high band width of 6 GHz at the center frequency of 20 GHz.
  • Keywords
    ferromagnetic materials; finite element analysis; microwave isolators; microwave materials; nanowires; E-plane resonance isolator; H-plane resonance isolator; bandwidth 6 GHz; demagnetization; double slab configuration; ferromagnetic nanowire; finite element method; finite integration technique; frequency 20 GHz; heat dissipation capability; quadruple slab configuration; Ferrites; Isolators; Magnetic resonance; Microwave theory and techniques; Saturation magnetization; Slabs;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microwave Conference Proceedings (APMC), 2010 Asia-Pacific
  • Conference_Location
    Yokohama
  • Print_ISBN
    978-1-4244-7590-2
  • Electronic_ISBN
    978-1-902339-22-2
  • Type

    conf

  • Filename
    5728172