Co-design and modeling of novel packaging interposer with IPD layers

Three innovative topics are presented in this research. First, the structure of packaging interposer with IPD layers is proposed and broadband equivalent model of TSV has been extracted. Second, a co-design case which includes coplanar waveguide transfer layers from top to bottom side with TSV is simulated and compared between TSV equivalent model we performed and 3D full wave EM simulation. Third, a resonator design case with TSV, which combines an inductor, a capacitor and the TSV equivalent model. The simulation results of the structure and equivalent model proof the broadband accuracy of TSV equivalent model.