Power module with additional low inductive current path

Parasitic inductances are a major problem with power modules, in particular in fast switching applications. The parasitic inductance of the component interconnections causes an overvoltage condition and increases the switchoff losses in the semiconductor. Many initiatives have been investigated to reduce the parasitic inductance in power modules utilizing a complex mechanical construction of overlapping internal bus bars forming the DC path. An alternative to this approach, which is outlined within this writing, is a concept using today´s standard power module construction but providing an additional ultra low inductive path for the transient current.