DocumentCode :
541267
Title :
Cause analysis on the break of isolator helical spring
Author :
Yang, Qing-xu ; Yang, Chao ; Zhang, Jian-guo
Author_Institution :
Jangsu Electr. Power Res. Inst. Co. Ltd., Nanjing, China
fYear :
2010
fDate :
13-16 Sept. 2010
Firstpage :
1
Lastpage :
4
Abstract :
Carries on the fracture macroscopic analysis, the SEM analysis, degree of hardness inspection, the chemical element analysis and the organization analysis to the break isolator helical spring, thought the isolator spring because of the surface decarburization level existence, receives the outer layer fixed friction to cause the micro crack the germination, the expansion is the spring break primary cause..
Keywords :
crack detection; fracture; hardness testing; microcracks; scanning electron microscopy; springs (mechanical); SEM analysis; break cause analysis; chemical element analysis; fracture macroscopic analysis; hardness inspection degree; isolator helical spring; microcrack; organization analysis; outer layer fixed friction; surface decarburization level; Chemical elements; Inspection; Manganese; Silicon; Surface cracks; Surface morphology; Analysis; Break; Isolator helical spring;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electricity Distribution (CICED), 2010 China International Conference on
Conference_Location :
Nanjing
Print_ISBN :
978-1-4577-0066-8
Type :
conf
Filename :
5735974
Link To Document :
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