DocumentCode :
542069
Title :
Application Technology of MEMS Inertial System
Author :
Liu, Jun ; Li, Jie ; Ke, Yan ; Wang, Bo
Author_Institution :
Nat. Key Lab. for Electron. Meas., North Univ. of China, Taiyuan, China
Volume :
1
fYear :
2010
fDate :
13-14 Oct. 2010
Firstpage :
379
Lastpage :
381
Abstract :
The testing system based MEMS inertial devices is a kind special measurement system which is integrated with MEMS inertial sensor, ASIC and its corresponding software. Because of having merits such as small bulk, low cost, light weight, high reliability, and anti-harsh environments, it is widely used in the military and civil fields, especially suited for the high-g guided ammunition, but use what material and how to package, are the greatest challenge for these systems in high-g application. In this study, we first analyzed the character of the common packaging materials in detail, then combined with the projectile application, gave the method of choosing the proper packaging materials, and introduced its correct packaging process, finally carried out the high-g tests by using the hammer impact experiment desk and the projectile. It was found that the system can successful survived at high-g environment, this indicated that the system based MEMS inertial sensors can be used in high-g application field by choosing appropriate packaging material and using corresponding packaging craft.
Keywords :
application specific integrated circuits; inertial navigation; measurement systems; micromechanical devices; packaging; sensors; ASIC; MEMS inertial sensor; MEMS inertial system; antiharsh environment; high-g guided ammunition; high-g test; packaging material; packaging process; projectile application; special measurement system; Materials; Micromechanical devices; Packaging; Projectiles; Solid modeling; Temperature measurement; Testing; application technology; inertial sensors; mems;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Intelligent System Design and Engineering Application (ISDEA), 2010 International Conference on
Conference_Location :
Changsha
Print_ISBN :
978-1-4244-8333-4
Type :
conf
DOI :
10.1109/ISDEA.2010.271
Filename :
5743202
Link To Document :
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