Mathematical modeling of thermal processes in structural elements of LED

Issue represent the mathematical model of thermal processes in piecewise homogeneous structure with the heating inclusion, which is an construction element of design High Power Light Emitting Diodes (LED´s). Solution of model problem founding by analytical method, which ensures the accuracy of this interpretation. Having obtained the temperature distribution for this element thermal resistance obtained by the principle of electro-thermal simulation. Considered LED´s electro-thermal scheme and show that one of its basic elements - heat resistance between the p-n junction and substrate is submitted to the proposed model.