Title :
Introduction to latest RF test technologies in RF ATE for low test cost and high throughput
Author_Institution :
ADVANTEST Corp., Gunma, Japan
Abstract :
This paper describes latest RF ATE (Automated Test Equipments) technologies including DUT (Device under Test) connections, calibration method as well as RF test module. A major interest of RF test is cost of test (COT). Most important respect for low COT is how achieve a number of simultaneous measurements and short test time. We realized the both respects by drastically downsized RF test module with multiple resources and high throughput. The module is installed in our RF ATE systems, and contributes for reducing COT. To improve efficiency of simultaneous measurements, RF calibration and DUT board are also very important. Major contribution for downsizing of the RF test module is RF circuit technology in form of RF functional system in package (RF-SIPs).
Keywords :
automatic test equipment; calibration; costing; integrated circuit testing; radiofrequency integrated circuits; system-in-package; RF ATE; RF circuit technology; RF functional system in package; RF test module; RF test technology; automated test equipments technologies; calibration method; cost of test; device under test connections; high throughput; low test cost; Calibration; Correlation; Radio frequency; Sockets; Testing; Throughput; Transmission line measurements;
Conference_Titel :
Microwave Conference Proceedings (CJMW), 2011 China-Japan Joint
Conference_Location :
Hangzhou
Print_ISBN :
978-1-4577-0625-7
Electronic_ISBN :
978-7-308-08555-7