DocumentCode :
545683
Title :
Introduction to latest RF test technologies in RF ATE for low test cost and high throughput
Author :
Kimishima, M.
Author_Institution :
ADVANTEST Corp., Gunma, Japan
fYear :
2011
fDate :
20-22 April 2011
Firstpage :
1
Lastpage :
8
Abstract :
This paper describes latest RF ATE (Automated Test Equipments) technologies including DUT (Device under Test) connections, calibration method as well as RF test module. A major interest of RF test is cost of test (COT). Most important respect for low COT is how achieve a number of simultaneous measurements and short test time. We realized the both respects by drastically downsized RF test module with multiple resources and high throughput. The module is installed in our RF ATE systems, and contributes for reducing COT. To improve efficiency of simultaneous measurements, RF calibration and DUT board are also very important. Major contribution for downsizing of the RF test module is RF circuit technology in form of RF functional system in package (RF-SIPs).
Keywords :
automatic test equipment; calibration; costing; integrated circuit testing; radiofrequency integrated circuits; system-in-package; RF ATE; RF circuit technology; RF functional system in package; RF test module; RF test technology; automated test equipments technologies; calibration method; cost of test; device under test connections; high throughput; low test cost; Calibration; Correlation; Radio frequency; Sockets; Testing; Throughput; Transmission line measurements;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Microwave Conference Proceedings (CJMW), 2011 China-Japan Joint
Conference_Location :
Hangzhou
Print_ISBN :
978-1-4577-0625-7
Electronic_ISBN :
978-7-308-08555-7
Type :
conf
Filename :
5773938
Link To Document :
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