• DocumentCode
    546602
  • Title

    The gap waveguide as a metamaterial-based electromagnetic packaging technology enabling integration of MMICs and antennas up to THz

  • Author

    Kildal, Per-Simon ; Maci, Stefano ; Valero-Nogueira, Alejandro ; Kishk, Ahmed ; Rajo-Iglesias, Eva

  • Author_Institution
    Chalmers Univ. of Technol., Gothenburg, Sweden
  • fYear
    2011
  • fDate
    11-15 April 2011
  • Firstpage
    3715
  • Lastpage
    3718
  • Abstract
    This paper presents new topics that will be lectured in the short course Metamaterials for Antennas within the European School of Antennas in Spring 2012. These relates to new so-called gap waveguides that are advantageous for use above 30 GHz, because they are quasi-TEM over wide bandwidth, and do neither require dielectric material nor conductive joints between metal parts. The gap waveguides originate from research on soft and hard surfaces that also are forerunners for EBG surfaces (acting as isotropic soft surfaces) and metamaterial cloaks (realized first by hard surfaces). The course will contain material related to all these topics, and in addition an overview of the last years research on the gap waveguides including experimental demonstration of principles as well as working hardware components. In this presentation special emphasis will be given to electromagnetic (EM) packaging, the principle of PMC packaging and integration of MMICs.
  • Keywords
    MMIC; dielectric materials; integrated circuit packaging; metamaterial antennas; photonic band gap; terahertz wave devices; waveguide antennas; EBG surfaces; MMIC; PMC packaging; conductive joints; dielectric material; gap waveguide; isotropic soft surfaces; metamaterial cloaks; metamaterial-based electromagnetic packaging technology; quasi-TEM; Antennas; Electromagnetic waveguides; Microstrip; Nails; Packaging; Surface waves; Waveguide discontinuities;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Antennas and Propagation (EUCAP), Proceedings of the 5th European Conference on
  • Conference_Location
    Rome
  • Print_ISBN
    978-1-4577-0250-1
  • Type

    conf

  • Filename
    5782375