Title :
A cool packaging technology for power conversion application
Author :
Fu, Xiao ; Jin, M.
Author_Institution :
Coll. of Econ. & Manage., Chongqing Univ. of Posts & Telecommun., Chongqing, China
Abstract :
Power management relieves critical bottlenecks in saving electrical energy and efficient switching devices are particularly required for synchronous power conversion module. To optimize both switching and thermal efficiencies for convertor configuration it relies on the advanced package technology. An analysis has been undertaken in this work to identify the challenge on power electronic packages to ensure the system efficiencies continue to increase. This paper presents an innovative three-dimension (3D) packaging technology - CoolPAK, which enables high voltage, high frequency and high reliable voltage switching with reduced power loss in thermal dissipation.
Keywords :
power conversion; switching convertors; thermal management (packaging); CoolPAK; cool packaging technology; electrical energy saving; innovative three-dimension packaging technology; power electronic packages; power loss; power management; switching convertor; switching devices; synchronous power conversion module; system efficiency; thermal dissipation; thermal efficiency; voltage switching; Bonding; Copper; Electronic packaging thermal management; Lead; Switches; Thermal resistance; half- bridge circuit; power convertor; semiconductor package; switching efficiency; thermal efficiency;
Conference_Titel :
Computer Science and Automation Engineering (CSAE), 2011 IEEE International Conference on
Conference_Location :
Shanghai
Print_ISBN :
978-1-4244-8727-1
DOI :
10.1109/CSAE.2011.5952473
