Compact flip-chip interconnection 8 x 50 Gbit/s EADFB laser array module for 400 Gbit/s transceiver

Author

Kanazawa, S. ; Fujisawa, T. ; Ohki, Akira ; Takahata, K. ; Sanjoh, H. ; Iga, R. ; Ishii, Hiroyuki

Author_Institution

NTT Photonics Labs., NTT Corp., Atsugi, Japan

Volume

50

Issue

7

fYear

2014

fDate

March 27 2014

Firstpage

533

Lastpage

534

Abstract

The first compact electroabsorption modulators integrated with distributed-feedback (EADFB) laser array module using flip-chip interconnects have been fabricated for a 400 Gbit/s transceiver. Eight 50 Gbit/s EADFB lasers and an optical multiplexer were monolithically integrated on one chip in an area of only 3.2 × 4.8 mm. The flip-chip interconnects provide a higher modulation bandwidth. Clear eye opening was achieved for all eight lanes under 50 Gbit/s operation.

Keywords

distributed feedback lasers; electro-optical modulation; flip-chip devices; integrated optics; integrated optoelectronics; laser arrays; monolithic integrated circuits; multiplexing; optical fabrication; optical interconnections; optical transceivers; semiconductor lasers; EADFB laser array module; bit rate 400 Gbit/s; bit rate 50 Gbit/s; clear eye opening; compact flip-chip interconnection; distributed-feedback laser; electroabsorption modulators; modulation bandwidth; monolithic integration; optical multiplexer; size 3.2 mm; size 4.8 mm; transceiver;

fLanguage

English

Journal_Title

Electronics Letters

Publisher

iet

ISSN

0013-5194

Type

jour

DOI

10.1049/el.2013.4276

Filename

6780241