Title :
Sub-fF 130 nm MOS Varactor Characterization Using 6.8 GHz Interferometry-Based Reflectometer
Author :
Maris Ferreira, Pietro ; Donche, Cora ; Delalin, Ambroise ; Quemerais, Thomas ; Gloria, Daniel ; Lasri, Tuami ; Dambrine, Gilles ; Gaquiere, Christophe
Author_Institution :
GeePs, Gif-sur-Yvette, France
Abstract :
Nanometer-scaled communication devices for microwave and millimeter wave applications motivated innovative techniques in modeling and characterization. In this letter, an interferometry-based reflectometer (IBR), comprising Vector Network Analyser (VNA) and commercial devices, is implemented. Using sub-fF 130 nm thick-oxide accumulation MOS varactors from ST Microelectronics, IBR and VNA measurements are compared to a silicon-based model. A capacitance from 0.9 to 1.6 fF around 6.8 GHz is estimated. IBR demonstrates a root-mean-squared (RMS) error related to silicon-based model of 60 aF, while VNA has 70 aF in its best case. The mean accuracy is estimated at 40 aF and 11 aF respectively for VNA best case and IBR in C-V measurements. This letter demonstrates that IBR solution has smaller RMS error and better accuracy for C-V measurements than VNA.
Keywords :
MIS devices; interferometry; mean square error methods; network analysers; reflectometers; varactors; C-V measurements; IBR solution; RMS error; ST microelectronics; VNA measurements; capacitance 0.9 fF to 1.6 fF; capacitance 60 aF; capacitance 70 aF; commercial devices; frequency 6.8 GHz; interferometry-based reflectometer; mean accuracy; microwave applications; millimeter wave applications; nanometer-scaled communication devices; root-mean-squared error; silicon-based model; size 130 nm; sub-fF thick-oxide accumulation MOS varactors; vector network analyser; Accuracy; Capacitance-voltage characteristics; Instruments; Microwave measurement; Microwave theory and techniques; Transmission line measurements; Varactors; High-impedance microwave and millimeter wave instrumentation; interferometry-based reflectometer; sub-fF MOS varactor;
Journal_Title :
Microwave and Wireless Components Letters, IEEE
DOI :
10.1109/LMWC.2015.2421326