A cost-effective thermal managed high output power VECSEL with hybrid mirror on Copper substrate at l,55µm

A 1.55 μm OP-VECSEL with electro-deposited copper substrate was optimized for lasing operation. It is a cost-effective solution compared with CVD diamond substrate assembled by metallic bonding. Experimental results showed that the effective thermal resistance R_th of a 60-μm diameter OP-VECSEL with ~150-μm thick copper substrate was 34±3 K/W. In plane concave cavity, maximum output power of 42,3mW was achieved at 25°C when a 980nm single mode pump laser with pump power ~450mw was used, showing the potentiality of external cavity semiconductor disk lasers to generate mode-locked pulse train at 1.55 μm when it will be assembled with a fast saturable absorber mirror (SESAM).