Title :
Hybrid modeling of non-stationary process variations
Author :
Dyer, Eva ; Majzoobi, Mehrdad ; Koushanfar, Farinaz
Author_Institution :
ECE Dept., Rice Univ., Houston, TX, USA
Abstract :
Accurate characterization of spatial variation is essential for statistical performance analysis and modeling, post-silicon tuning, and yield analysis. Existing approaches for spatial modeling either assume that: (i) non-stationarities arise due to a smoothly varying trend component or that (ii) the process is stationary within regions associated with a predefined grid. While such assumptions may hold when profiling certain classes of variations, a number of recent modeling studies suggest that non-stationarities arise from both shifts in the process mean as well as fluctuations in the variance of the process. In order to provide a compact model for non-stationary process variations, we introduce a new hybrid spatial modeling framework that models the spatially varying random field as a union of non-overlapping rectangular regions where the process is assumed to be locally-stationary within each region. To estimate the parameters in our hybrid spatial model, we develop a host of techniques to both estimate the change-points in the random field and to find an appropriate partitioning of the chip into disjoint regions where the field is locally-stationary. We verify our models and results on measurements collected from 65nm FPGAs.
Keywords :
elemental semiconductors; field programmable gate arrays; integrated circuit modelling; integrated circuit yield; silicon; statistical analysis; FPGA; Si; chip partitioning; compact model; hybrid spatial modeling; nonoverlapping rectangular regions; nonstationary process variations; post-silicon tuning; predefined grid; process mean; random field; size 65 nm; spatial variation; statistical performance analysis; yield analysis; Approximation methods; Correlation; Delay; Field programmable gate arrays; Semiconductor device measurement; Solid modeling; TV; Non-stationary Variation; Process Variation Modeling; Spatial Correlation;
Conference_Titel :
Design Automation Conference (DAC), 2011 48th ACM/EDAC/IEEE
Conference_Location :
New York, NY
Print_ISBN :
978-1-4503-0636-2