DocumentCode
549680
Title
Forming-free nitrogen-doped AlOX RRAM with sub-μA programming current
Author
Kim, Wanki ; Park, Sung Il ; Zhang, Zhiping ; Yang-Liauw, Young ; Sekar, Deepak ; Wong, H. -S Philip ; Wong, S. Simon
Author_Institution
Dept. of Electr. Eng., Stanford Univ., Stanford, CA, USA
fYear
2011
fDate
14-16 June 2011
Firstpage
22
Lastpage
23
Abstract
Nitrogen-doped AlOX Resistive RAM has been integrated on CMOS. The memory cell requires no forming, and sub-μA programming currents. The cell is capable of multi-bit storage, reliable for over 105 switching cycles and 10 years retention at 125°C.
Keywords
aluminium compounds; nitrogen; random-access storage; N:AlOX; memory cell; multibit storage; resistive RAM; sub-μA programming currents; temperature 125 degC; time 10 year; CMOS integrated circuits; Electrodes; Films; Nitrogen; Programming; Resistance; Switches;
fLanguage
English
Publisher
ieee
Conference_Titel
VLSI Technology (VLSIT), 2011 Symposium on
Conference_Location
Honolulu, HI
ISSN
0743-1562
Print_ISBN
978-1-4244-9949-6
Type
conf
Filename
5984614
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