• DocumentCode
    549713
  • Title

    Exact control of junction position and Schottky barrier height in dopant-segregated epitaxial NiSi2 for high performance metal source/drain MOSFETs

  • Author

    Mizubayashi, W. ; Migita, S. ; Morita, Y. ; Ota, H.

  • Author_Institution
    MIRAI-NIRC, Nat. Inst. of Adv. Ind. Sci. & Technol. (AIST), Tsukuba, Japan
  • fYear
    2011
  • fDate
    14-16 June 2011
  • Firstpage
    88
  • Lastpage
    89
  • Abstract
    This paper reports junction position control and the Schottky barrier height (ΦBn) tuning in ultrathin SOI MOSFETs with epitaxial NiSi2 source/drain (S/D). We demonstrate the junction position control in the lateral direction with preserving the (111) facet in 8-nm-thick SOI using epitaxial NiSi2 growth. ΦBn at epitaxial NiSi2 can be easily controlled by P+ implanted dose using dopant segregation technique, and the saturation drain current (IDSat.) increases due to lowering ΦBn. Thus, epitaxial NiSi2 is a promising metal S/D for future MOSFETs.
  • Keywords
    MOSFET; Schottky barriers; epitaxial growth; nickel compounds; position control; silicon-on-insulator; NiSi2; Schottky barrier height tuning; dopant segregation technique; dopant-segregated epitaxial source-drain; epitaxial growth; high-performance metal source-drain MOSFET; junction position control; metal S-D; saturation drain current; size 8 nm; ultrathin-SOI MOSFET; Annealing; Epitaxial growth; Junctions; Logic gates; MOSFETs; Metals; Position control;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    VLSI Technology (VLSIT), 2011 Symposium on
  • Conference_Location
    Honolulu, HI
  • ISSN
    0743-1562
  • Print_ISBN
    978-1-4244-9949-6
  • Type

    conf

  • Filename
    5984653