DocumentCode
549731
Title
Hot spot cooling evaluation using closed-channel cooling system (C3S) for MPU 3DI application
Author
Kim, Y.S. ; Kitada, H. ; Ohigashi, R. ; Ichiyanagi, M. ; Nakatsuka, J. ; Kinefuchi, I. ; Matsumoto, Y. ; Ohba, T.
Author_Institution
Inst. of Eng. Innovation, Univ. of Tokyo, Tokyo, Japan
fYear
2011
fDate
14-16 June 2011
Firstpage
144
Lastpage
145
Abstract
A novel closed-channel cooling system (C3S) for microprocessor application has been studied. A 0.038 cm2 micro heaters as small as hot spot block in MPUs are fabricated. Maximum temperature was 350 °C at 28 W/cm2 of power density. The cooling system enables decreasing temperature more than 30 °C with the liquid flow rate ranged 200 μl/min. It is found that micro bubble in water affects cooling efficiency due to vaporization kinetics. Cooling by water shows higher efficiency than that of IPA. With keeping lower micro bubble concentration of water, the heater temperature at 268 °C decreases to 143 and 63 °C at the flow rates of 100 and 600 μl/min, respectively.
Keywords
bubbles; cooling; microprocessor chips; three-dimensional integrated circuits; vaporisation; MPU 3DI application; closed-channel cooling system; hot spot cooling evaluation; microbubble concentration; microprocessor application; power density; vaporization kinetics; Coolants; Glass; Metals; Silicon; Water heating; MEMS; cooling; hot spot; planar type;
fLanguage
English
Publisher
ieee
Conference_Titel
VLSI Technology (VLSIT), 2011 Symposium on
Conference_Location
Honolulu, HI
ISSN
0743-1562
Print_ISBN
978-1-4244-9949-6
Type
conf
Filename
5984676
Link To Document