Title :
From 3D-SOC to 3D heterogeneous systems: Technology and applications
Author_Institution :
STMicroelectronics, Crolles, France
Abstract :
A wide range of requests coming from customer appears to demonstrate the feasibility of 3D Integration (3DI). The first industrial application is the CMOS Image Sensor. Medium to high density applications are related to consumer & wireless markets were 3DI overcomes limitations of SOC in term of performances, cost and time to market. For More than Moore applications, 3DI brings real heterogeneous integration with multi-physics systems such as complex camera module, wireless links and sensors.
Keywords :
CMOS image sensors; system-on-chip; three-dimensional integrated circuits; 3D heterogeneous systems; 3D integration; 3D-SOC; CMOS image sensor; Moore applications; multiphysics systems; CMOS image sensors; CMOS integrated circuits; Sensors; Silicon; System-on-a-chip; Three dimensional displays; Through-silicon vias; 3D Integration (3DI); 3D System-On-Chip (3D-SOC); Heterogeneous systems; Through Silicon Via (TSV); Wafer Level Packaging (WLP);
Conference_Titel :
VLSI Technology (VLSIT), 2011 Symposium on
Conference_Location :
Honolulu, HI
Print_ISBN :
978-1-4244-9949-6
